ProjectsTo be updated PresentThermal-aware fault-tolerance 3D interconnectFunded by NAFOSTED under No. 102.01-2018.312 (2019-2011). Past2014-2017: Comprehensive fault-tolerant 3D Network-on-Chip architecture2011-2014: Inter-prediction module for H.264/AVC encoder2010-2011: FPGA Implementation of Network-on-Chip |