Projects

Present

Thermal-aware fault-tolerance 3D interconnect

Funded by NAFOSTED under No. 102.01-2018.312 (2019-2011).

Past

2014-2017: Comprehensive fault-tolerant 3D Network-on-Chip architecture

2011-2014: Inter-prediction module for H.264/AVC encoder

2010-2011: FPGA Implementation of Network-on-Chip