Publications

Book Chapter

  1. Khanh N. Dang and Abderazek Ben Abdallah, ”Architecture and Design Methodology for Highly-Reliable TSV-NoC Systems”, Invited Book Chapter, Horizons in Computer Science Research. Volume 16, Chapter 7. Nova Science Publishers, 2018. [link, pdf].

Refereed Journal Publications

  1. Khanh N. Dang, Michael Meyer, Akram Ben Ahmed, Abderazek Ben Abdallah, and Xuan-Tu Tran, “2D Parity Product Code for TSV online fault correction and detection”, REV Journal on Electronics and Communications (JEC) (accepted with minor revision)

  2. Khanh N. Dang, Akram Ben Ahmed, Ben Abdallah Abderrazak and Xuan-Tu Tran, “TSV-OCT: A scalable online multiple TSV defects localization for 3D-ICs”, IEEE Transactions on Very Large Scale Integration Systems (TVLSI) (accepted) [preprint]

  3. Khanh N. Dang and Xuan-Tu Tran, “An adaptive and high coding rate soft error correction method in Network-on-Chips”, VNU Journal of Computer Science and Communication Engineering, ISSN 0866-8612, Volume 35, No 1, pp 32-45, 2019. [link]

  4. Khanh N. Dang, Akram Ben Ahmed, Yuichi Okuyama, Abderazek Ben Abdallah, “Scalable design methodology and online algorithm for TSV-cluster defects recovery in highly reliable 3D-NoC systems”, IEEE Transactions on Emerging Topics in Computing (TETC), IEEE, (in press). [link].

  5. Khanh N. Dang, Akram Ben Ahmed, Xuan-Tu Tran, Yuichi Okuyama, Abderazek Ben Abdallah, “A Comprehensive Reliability Assessment of Fault-Resilient Network-on-Chip Using Analytical Model”, IEEE Transactions on Very Large Scale Integration Systems (TVLSI), IEEE, Volume 25, Issue 11, pp 3099-3112, 2017. [link].

  6. Khanh N. Dang, Michael Meyer, Yuichi Okuyama, Abderazek Ben Abdallah, “A Low-overhead Soft-Hard Fault Tolerant Architecture, Design and Management Scheme for Reliable High-performance Many-core 3D-NoC Systems”, Journal of Supercomputing, Springer, Volume 73, Issue 6, pp 2705–2729, 2017. [link].

  7. Ngoc-Mai Nguyen, Edith Beigne, Duy-Hieu Bui, Nam-Khanh Dang, Suzanne Lesecq, Pascal Vivet, Xuan-Tu Tran, “An Overview of H.264 Hardware Encoder Architectures including Low-Power Features”, REV Journal on Electronics and Communications (JEC), pp. 8-17, Vol. 4, No. 1-2, Jan. - Jun., 2014. [link].

Refereed Conference Papers

  1. Khanh N. Dang and Abderazek Ben Abdallah “An Efficient Software-Hardware Design Framework for Spiking Neural Network Systems”, IINTEC 2019 (under review)

  2. Mark Ogbodo, The Vu, Khanh N. Dang and Abderazek Abdallah, “Light-weight Spiking Neuron Processing Core for Large-scale 3D-NoC based Spiking Neural Network Processing Systems”, (under review)

  3. Khanh N. Dang, Michael Meyer, Akram Ben Ahmed, Abderazek Ben Abdallah, and Xuan-Tu Tran, “2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults”, 2019 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS 2019), Nov. 11-14, 2019 (accepted).

  4. Khanh N. Dang, Akram Ben Ahmed, and Xuan-Tu Tran, “ An on-communication multiple-TSV defects detection and localization for real-time 3D-ICs”, 2019 IEEE 13th International Symposium on Embedded Multicore/Many-core Systems-on-Chip (MCSoC), Oct. 1-4, 2019 (in press).

  5. Khanh N. Dang, Akram Ben Ahmed, Ben Abdallah Abderrazak and Xuan-Tu Tran, “TSV-IaS: Analytic analysis and low-cost non-preemptive on-line detection and correction method for TSV defects”, The IEEE Symposium on VLSI (ISVLSI) 2019, Jul. 15-17, 2019 (in press).

  6. Khanh N. Dang and Xuan-Tu Tran, “Parity-based ECC and Mechanism for Detecting and Correcting Soft Errors in On-Chip Communication”, 2018 IEEE 12th International Symposium on Embedded Multicore/Many-core Systems-on-Chip (MCSoC), Sep. 12-14, 2018.

  7. Abderazek Ben Abdallah, Khanh N. Dang, Yuichi Okuyama, “A Low-overhead Fault tolerant Technique for TSV-based Interconnects in 3D-IC Systems”, The 18th International conference on Sciences and Techniques of Automatic control and computer engineering (STA’2017), Dec. 21-23, 2017.

  8. Shunsuke Mie, Yuichi Okuyama, Yusuke Sato, Ye Chan, Nam Khanh Dang, Ben Abdellash Abderazek, “Real-Time UAV Attitude Heading Reference System Using Extended Kalman Filter for Programmable SoC”, 2017 IEEE 11th International Symposium on Embedded Multicore/Many-core Systems-on-Chip (MCSoC), Sep. 18-20, 2017.

  9. Khanh N. Dang, Michael Meyer, Yuichi Okuyama, Abderazek Ben Abdallah, “Reliability Assessment and Quantitative Evaluation of Soft-Error Resilient 3D NoC System”, 25th IEEE Asian Test Symposium (ATS’16), Nov. 21-24, 2016.

  10. Khanh N. Dang, Yuichi Okuyama, Abderazek Ben Abdallah, “Soft-Error Resilient Network-on-Chip for Safety-Critical Applications”, 2016 IEEE International Conference on Integrated Circuit Design and Technology (ICICDT), Jun. 27 – 29, 2016.

  11. Khanh N. Dang, Michael Meyer, Yuichi Okuyama, Abderazek Ben Abdallah, Xuan-Tu Tran, “Soft-Error Resilient 3D Network-on-Chip Router”, IEEE 7th International Conference on Awareness Science and Technology (iCAST 2015), Sep. 22-24, 2015.

  12. Ngoc-Mai Nguyen, Edith Beigne, Suzanne Lesecq, Duy-Hieu Bui, Nam-Khanh Dang, Xuan-Tu Tran, “H.264/AVC Hardware Encoders and Low-Power Features”, 2014 IEEE Asia Pacific Conference on Circuits & Systems (APCCAS 2014), Nov. 17-20, 2014.

  13. Nam-Khanh Dang, Xuan-Tu Tran, Alain Merigot, “An Efficient Hardware Architecture for Inter-Prediction in H.264/AVC Encoders”,17th IEEE Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS 2014), Apr. 23-25, 2014.

  14. Nam Khanh Dang, Van-Mien Nguyen, Xuan Tu Tran, “A VLSI Implementation for Inter-Prediction Module in H.264/AVC Encoders”, 2013 International Conference on Integrated Circuits and Devices in Vietnam (ICDV 2013), 2013.

  15. Nam Khanh Dang, Thanh Vu Le Van, Xuan Tu Tran, “FPGA implementation of a low latency and high throughput network-on-chip router architecture”, 2011 International Conference on Integrated Circuits and Devices in Vietnam (ICDV 2011), 2011.

Patent

  1. A. Ben Abdallah, Khanh N. Dang, Masayuki Hisada, “A TSV fault-tolerant router system for 3D-Networks-on-Chip”, 特願 2017-218953, Japan patent (under review).

Presentations

  1. Khanh N. Dang, “Toward Real-time Fault-tolerance Through-Silicon-Via based 3D Network-on-Chips”, The 2nd IEEE South-East Asia Workshop on Circuits and Systems (SEACAS 2018), Bandung, Indonesia, 2018.

  2. Khanh N. Dang, “Fault-Tolerant Architectures and Algorithms for 3D-Network-on-Chips”, The 1st IEEE South-East Asia Workshop on Circuits and Systems (SEACAS 2017), Hanoi, Vietnam, 2017.

Thesis

  1. Dang Nam Khanh ”Development of On-Chip Communication Fault-Resilient Adaptive Architectures and Algorithms for 3D-IC Technologies (3次元IC技術のための適応型耐障害チップ内通信アーキテクチャとアルゴリズムの開発)”, Research advisor: Prof. Abderazek Ben Abdallah. [link].